Reliability study on high power LED with chip on board

Author

Liu, Dongjing ; Yang, D.G. ; Ren, Rongbin ; Hou, Fengze ; Huang, Chao

Author_Institution

Guangxi Key Lab. of Manuf. Syst. & Adv. Manuf. Technol., Guilin Univ. of Electron. Technol., Guilin, China

fYear

2011

fDate

8-11 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

In this paper the reliability of high power LED street lamp subjected to temperature cycle is analyzed. Two kinds of finite element models of LED street lamp structure with 60W input power are established by using ANSYS software. The temperature cycling condition from -5°C to 50°C is loaded. The increasing and decreasing rate of temperature is 5°C / min and the holding time is 30 minutes. This process is consisted of 8 cycle periods and returns to room temperature 25°C for initial temperature. The results demonstrate the deformation of integrated LED street lamp structure can reach 2.17μm while that of LED lamp array is only 5nm. The results provide the basic for further study on LED street lamp failure mechanism and reliability design for LED street lamp.

Keywords

LED lamps; failure analysis; finite element analysis; reliability; ANSYS software; LED lamp array; LED street lamp failure mechanism; LED street lamp structure; chip on board; finite element models; high power LED street lamp; power 60 W; reliability design; size 2.17 mum; size 5 nm; temperature -5 degC to 50 degC; time 30 min; Arrays; Electronic packaging thermal management; Light emitting diodes; Materials; Reliability; Stress; Thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4577-1770-3

Electronic_ISBN

978-1-4577-1768-0

Type

conf

DOI

10.1109/ICEPT.2011.6066998

Filename

6066998