Title :
Reliability study on high power LED with chip on board
Author :
Liu, Dongjing ; Yang, D.G. ; Ren, Rongbin ; Hou, Fengze ; Huang, Chao
Author_Institution :
Guangxi Key Lab. of Manuf. Syst. & Adv. Manuf. Technol., Guilin Univ. of Electron. Technol., Guilin, China
Abstract :
In this paper the reliability of high power LED street lamp subjected to temperature cycle is analyzed. Two kinds of finite element models of LED street lamp structure with 60W input power are established by using ANSYS software. The temperature cycling condition from -5°C to 50°C is loaded. The increasing and decreasing rate of temperature is 5°C / min and the holding time is 30 minutes. This process is consisted of 8 cycle periods and returns to room temperature 25°C for initial temperature. The results demonstrate the deformation of integrated LED street lamp structure can reach 2.17μm while that of LED lamp array is only 5nm. The results provide the basic for further study on LED street lamp failure mechanism and reliability design for LED street lamp.
Keywords :
LED lamps; failure analysis; finite element analysis; reliability; ANSYS software; LED lamp array; LED street lamp failure mechanism; LED street lamp structure; chip on board; finite element models; high power LED street lamp; power 60 W; reliability design; size 2.17 mum; size 5 nm; temperature -5 degC to 50 degC; time 30 min; Arrays; Electronic packaging thermal management; Light emitting diodes; Materials; Reliability; Stress; Thermal analysis;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6066998
