Title :
Reliability test and simulation analyses for high power LED
Author :
Weitao, Zhu ; Kailin, Pan ; Guotao, Ren ; Jing, Huang
Author_Institution :
Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China
Abstract :
High power LED products intended for outdoor applications need specific tests to evaluate its reliability. In this paper acceleration tests for LED samples at high temperatures and currents below the rating conditions, have been carried out. Considering the high junction temperature of LED chip is the main reason which caused the decreased optical efficiency output, and the typical failure models for degradation of optical efficiency have been analyzed by reliability tests and simulation.
Keywords :
life testing; light emitting diodes; light sources; reliability; LED chip; high junction temperature; high power LED; light source; optical efficiency output; reliability testing; simulation analyses; typical failure model; Degradation; Light emitting diodes; Stress; Temperature; Temperature measurement; Thermal resistance;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
DOI :
10.1109/ICEPT.2011.6067002
