Towards an ultra-high density interconnect (UHDI) technology

We present a plastic based 3-D MCM technology with a path for achieving ultra-high densities with abroad array of applications. This path has been chosen as a means for realizing novel next generation digital architectures. The 3D MCM is composed of layers of a plastic based MCM interconnected together with a z-axis conductive adhesive film. Each 2D MCM is fabricated with feed throughs which provide a connection from the top to the back side of the MCM. In this paper, we will demonstrate this new technology with a four layer 3D mechanical stack with a stack thickness of 1.2 mm and a Si density of 58 mm³ /IC. We will also presented a path towards forming an ultra-thin 3D stack by reducing the thickness of the plastic substrate and the interconnect layer