Title :
Towards an ultra-high density interconnect (UHDI) technology
Author :
Krishnamurthy, V. ; Rose, J. ; Saia, R. ; Durocher, K.
Author_Institution :
Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
Abstract :
We present a plastic based 3-D MCM technology with a path for achieving ultra-high densities with abroad array of applications. This path has been chosen as a means for realizing novel next generation digital architectures. The 3D MCM is composed of layers of a plastic based MCM interconnected together with a z-axis conductive adhesive film. Each 2D MCM is fabricated with feed throughs which provide a connection from the top to the back side of the MCM. In this paper, we will demonstrate this new technology with a four layer 3D mechanical stack with a stack thickness of 1.2 mm and a Si density of 58 mm3 /IC. We will also presented a path towards forming an ultra-thin 3D stack by reducing the thickness of the plastic substrate and the interconnect layer
Keywords :
adhesion; elemental semiconductors; integrated circuit packaging; multichip modules; polymer films; silicon; 1.2 mm; 2D MCM; 3D MCM; Si; Si density; abroad array; feed throughs; four layer 3D mechanical stack; interconnect layer; next generation digital architectures; plastic based MCM; plastic substrate; stack thickness; ultra-high densities; ultra-high density interconnect technology; ultrathin 3-D stack; z-axis conductive adhesive film; Conductive adhesives; Conductive films; Electronics packaging; Feeds; Integrated circuit interconnections; Microelectronics; Plastic films; Space technology; Stacking; Substrates;
Conference_Titel :
Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-4150-3
DOI :
10.1109/DASC.1997.635037
