DocumentCode :
2188516
Title :
Structural design and heat dissipation research of integrated 3W white LED miner´s lamp
Author :
Ren, Rongbin ; Yang, Daoguo ; Liu, Dongjing
Author_Institution :
Guangxi Key Lab. of Manuf. Syst. & Adv. Manuf. Technol., Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2011
fDate :
8-11 Aug. 2011
Firstpage :
1
Lastpage :
5
Abstract :
As the rapid development of technology, LED is gradually becoming the leader of lighting sources. Miner´s lamp is the miner´s eyes. Comparing with conventional miner´s lamp, LED miner´s lamp has many advantages such as less weight, less volume, higher luminous efficiency, greener, longer lifetime and son on. But heat dissipation of LED is still the bottle neck which limits the development of LED. LED miner´ lamp contains two light sources which are main light source and secondary light source. This paper applied one integrated 3W COB white LED as the main light source and three 0.2W white LEDs as the secondary light source. Main light source and heat spreader are designed by building finite element models in this paper. The Models of different distance among chips, different number of fins, different height of fins and different shape of fins had been builded and analysed. It can be seen that within a certain range further distance among chips, more number of fins and higher height of fins would lead to lower junction temperature. Four shapes that are thin plate, cyclic thin plate, symmetrical square column and stagger square column had been analysed. It can be observed that the shape of symmetrical square column is the best, because the junction temperature of LED is the lowest. And cyclic thin plate is the second best, and stagger square column is the worst.
Keywords :
LED lamps; cooling; finite element analysis; COB white LED; cyclic thin plate; finite element models; heat dissipation; heat spreader; integrated white LED miner lamp; lighting sources; power 0.2 W; power 3 W; stagger square column; structural design; symmetrical square column; thin plate; Cavity resonators; Heating; Integrated circuit modeling; Junctions; Light emitting diodes; Light sources; Shape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-1770-3
Electronic_ISBN :
978-1-4577-1768-0
Type :
conf
DOI :
10.1109/ICEPT.2011.6067011
Filename :
6067011
Link To Document :
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