DocumentCode :
2188540
Title :
Simulation analysis of one electronic equipment
Author :
Xie, P.H. ; Tan, Z.L. ; Bi, J.J. ; Liu, W.L.
Author_Institution :
Inst. of Electrostatic&Electromagn. Protection, Mech. Eng. Coll., Shijiazhuang, China
fYear :
2009
fDate :
16-20 Sept. 2009
Firstpage :
212
Lastpage :
215
Abstract :
Electromagnetic simulation software FEKO was used to set up the equipment model and plane wave environment. Data showed: when frequency was lower than 50 MHz, the corresponding electromagnetic coupling field of the window appeared round distribution (x=13.4), but when frequency was higher than 250 MHz, the regional border of the window coupling field became more and more fuzzy; When frequency was 50 MHz, the back-door seam region appeared strong reaction electric current; when frequency was 650 MHz, the body surface of shell around the back door presented strong reaction electric current, and the surface reaction electric current of back door was relatively weak, which reflected the separating effect of the back-door seam; when frequency was 900 MHz, strong electromagnetic coupling area appeared outside the back door, the initial analysis was the transmission function of the equivalent aerial for the window; when frequency was from 250 MHz to 900 MHz, the reflection strengthen function to the coupling field around of the package within the equipment got obvious; very obvious resonance phenomenon appeared when frequency was 900 MHz.
Keywords :
computational electromagnetics; electromagnetic fields; electronic equipment testing; FEKO electromagnetic simulation software; body surface; electromagnetic coupling field; frequency 650 MHz; surface reaction electric current; window coupling field; Analytical models; Current; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic modeling; Electromagnetic reflection; Electromagnetic scattering; Electronic equipment; Frequency; Packaging machines; FEKO; aperture; electromagnetic coupling; electronic equipment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Environmental Electromagnetics, 2009. CEEM 2009. 5th Asia-Pacific Conference on
Conference_Location :
Xian
Print_ISBN :
978-1-4244-4344-4
Type :
conf
DOI :
10.1109/CEEM.2009.5305305
Filename :
5305305
Link To Document :
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