• DocumentCode
    2188654
  • Title

    Static and dynamic analysis for high power light emitting diode street light fixtures under wind load

  • Author

    Liu, Xiaogang ; Zhaohui Chen ; Liu, Sheng

  • Author_Institution
    State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2011
  • fDate
    8-11 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As a newly lighting source, high power white light emitting diodes (LEDs) have many excellent performances and begin to be widely used. The LED street light fixture is one of the most typical and popular applications, which is studied and developed worldwide. However, those studies mainly focused on its light efficiency, light pattern, color temperature, and so on, few concentrated on the reliability of the LED street lighting, especially structure strength analysis and evaluation. In this paper, an 112 watt LED street light fixture is analyzed under wind load by simulations. Static and dynamic analysis under wind load are conducted, which contains static wind load analysis, modal analysis, harmonic response analysis, and transient dynamic analysis. Numerical simulation results show that it is necessary to make structure strength analysis for the design of LED street light fixtures.
  • Keywords
    light emitting diodes; light sources; modal analysis; numerical analysis; street lighting; LED; LED street lighting reliability; color temperature; dynamic wind load analysis; harmonic response analysis; high power light emitting diode street light fixtures; light efficiency; light pattern; modal analysis; numerical simulation; static wind load analysis; structure strength analysis; transient dynamic analysis; Fixtures; Harmonic analysis; Light emitting diodes; Lighting; Strain; Stress; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4577-1770-3
  • Electronic_ISBN
    978-1-4577-1768-0
  • Type

    conf

  • DOI
    10.1109/ICEPT.2011.6067018
  • Filename
    6067018