Title :
Low profile DC-DC power converter for 3-D electronics assembly
Author :
Korman, C.S. ; Ramakrishnan, Shankar ; Steigenvald, R.L. ; Fisher, R.A. ; Hennessy, W. ; Bicknell, W. ; Wojnarowski, R. ; Peczalski, A. ; Baier, S.
Author_Institution :
Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
Abstract :
A 130 W/in3 48Vdc-to-3.3Vdc power converter has been developed for an avionics distributed power system. This converter employs advanced packaging based on the GE-Lockheed Martin High Density Interconnect technology and new ultra low profile magnetics to provide a 150 mil high form factor that is consistent with high density 3D electronics packaging
Keywords :
DC-DC power convertors; III-V semiconductors; field effect transistor switches; gallium arsenide; military avionics; power field effect transistors; power semiconductor switches; power supplies to apparatus; semiconductor device packaging; 3.3 V; 3D electronics assembly; 48 V; DC-DC power converter; GE-Lockheed Martin; GaAs; GaAs complementary heterojunction FET; High Density Interconnect technology; advanced packaging; high density 3D electronics packaging; power converter; ultra low profile magnetics; Aerospace electronics; Assembly; DC-DC power converters; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Power semiconductor switches; Power system interconnection; Signal processing; Substrates;
Conference_Titel :
Digital Avionics Systems Conference, 1997. 16th DASC., AIAA/IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-4150-3
DOI :
10.1109/DASC.1997.635039
