Die bonding of single emitter semiconductor laser with nano-scale silver paste

One of the most important steps in the manufacturing of laser diodes is bonding the chip onto some sort of sub-mount that allows the laser to be handled, durable electrical connections to be made, and heat to be conducted away from the laser itself. The ability to conduct heat away from the laser is critical in keeping operating temperatures low, thus improving the laser´s performance and its lifetime. In this study, it´s the first time to use nano-scale silver paste as a die-attach material for die bonding the laser diodes. Numerous tests have been carried out to check the silver paste packaged laser´s performance, including electrical properties, spectral properties, far-field characteristics, thermal rollover characteristics and so on. The test results show that as a new interconnecting material, nano-silver paste has the potential to eliminate the deficiencies of the existing solders.