DocumentCode
2189013
Title
Via hole, bond wire and shorting pin modeling for multi-layered circuits
Author
Ming-Ju Tsai ; Tzyy-Sheng Horng ; Alexopoulos, N.G.
Author_Institution
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
fYear
1994
fDate
23-27 May 1994
Firstpage
1777
Abstract
This paper presents a full-wave spectral-domain analysis to model generalized three-dimensional circuits for multilayered structures. To describe properly the current along the vertical post, such as via holes, bond wires and shorting pins, etc., the simple pulse function is used in the procedure of the moment method. Several numerical techniques are applied to improve the evaluation of matrix elements. Comparison of numerical results with experimental and available analytical data shows good agreement.<>
Keywords
MMIC; microstrip components; microwave integrated circuits; modelling; numerical analysis; packaging; spectral-domain analysis; 3D microstrip circuits; bond wire modelling; full-wave spectral-domain analysis; matrix elements; moment method; multilayered circuits; multilayered structures; numerical techniques; pulse function; shorting pin modeling; three-dimensional circuits; via hole modelling; Bonding; Circuits; Data analysis; Moment methods; Pins; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location
San Diego, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1778-5
Type
conf
DOI
10.1109/MWSYM.1994.335097
Filename
335097
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