Title :
Via hole, bond wire and shorting pin modeling for multi-layered circuits
Author :
Ming-Ju Tsai ; Tzyy-Sheng Horng ; Alexopoulos, N.G.
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Abstract :
This paper presents a full-wave spectral-domain analysis to model generalized three-dimensional circuits for multilayered structures. To describe properly the current along the vertical post, such as via holes, bond wires and shorting pins, etc., the simple pulse function is used in the procedure of the moment method. Several numerical techniques are applied to improve the evaluation of matrix elements. Comparison of numerical results with experimental and available analytical data shows good agreement.<>
Keywords :
MMIC; microstrip components; microwave integrated circuits; modelling; numerical analysis; packaging; spectral-domain analysis; 3D microstrip circuits; bond wire modelling; full-wave spectral-domain analysis; matrix elements; moment method; multilayered circuits; multilayered structures; numerical techniques; pulse function; shorting pin modeling; three-dimensional circuits; via hole modelling; Bonding; Circuits; Data analysis; Moment methods; Pins; Wire;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335097
