Title :
Packaging and metallisation effects of valley microstrip line with slit for use in very small multilayer MMICs
Author :
Ao Sheng Rong ; Zhong Liang Sun
Author_Institution :
Dept. of Radio Eng., Southeast Univ., Nanjing, China
Abstract :
A comprehensive characterisation of valley microstrip lines with or without slits is proposed. When applied to very small multilayer MMICs, such new lines exhibit appreciable packaging and metallisation effects. Moreover, their characteristic parameters can be adjusted by changing the oblique angle and the slit width, which leads to flexible circuit design.<>
Keywords :
MMIC; integrated circuit technology; metallisation; microstrip lines; packaging; circuit design; metallisation; multilayer MMICs; packaging; slit; valley microstrip line; Circuit synthesis; MMICs; Metallization; Microstrip; Nonhomogeneous media; Packaging;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335108
