Designing a 100 MHz SPARC dual processor using MCM-L packaging technology and microwave design techniques

Author

Goyal, R.

Author_Institution

Mentor Graphics Corp., Wilsonville, OR, USA

fYear

1994

fDate

23-27 May 1994

Firstpage

1715

Abstract

This paper presents typical microwave design techniques applied to designing high speed MCMs for digital applications. Significantly improved MCM performance and reduced number of design iterations are achieved, by using these techniques. Further, a design of 100 MHz SPARC dual processor using MCM-L technology is presented, taking advantage of using unpackaged chips and design techniques frequently used in microwave designs.<>

Keywords

design engineering; microprocessor chips; microwave integrated circuits; multichip modules; parallel architectures; reconfigurable architectures; 100 MHz; MCM-L packaging technology; SPARC dual processor; design iterations; digital applications; high speed MCMs; microwave design techniques; unpackaged chips; Microwave technology; Microwave theory and techniques; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1994., IEEE MTT-S International

Conference_Location

San Diego, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-1778-5

Type

conf

DOI

10.1109/MWSYM.1994.335110

Filename

335110

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2189362