Rigorous field theory analysis of flip-chip interconnections in MMICs using the FDTLM method

Author

Jin, H. ; Vahldieck, R. ; Minkus, H. ; Huang, J.

Author_Institution

Lab. for Lightwave Electron., Microwaves & Commun., Victoria Univ., BC, Canada

fYear

1994

fDate

23-27 May 1994

Firstpage

1711

Abstract

This paper presents a rigorous 3-D field theory analysis of the flip-chip assembly by using the frequency-domain TLM method. The scattering parameters of the bump discontinuities are calculated in the cases of CPW and microstrip. Simulation results show that the flip-chip packaging using solder bump connecting the mother board and the chip provides better electrical performance in comparison with the conventional wire bonding approach. With the dimensions used in this paper, the reflections at the bump discontinuities are found to be better than -40 dB and -20 dB, respectively, for CPW and microstrip over the frequency spectrum from 1 GHz to 40 GHz.<>

Keywords

MMIC; flip-chip devices; frequency-domain analysis; integrated circuit technology; transmission line theory; 1 to 40 GHz; 3-D field theory analysis; CPW; MMICs; assembly; bump discontinuities; electrical performance; flip-chip interconnections; frequency-domain TLM method; microstrip; packaging; reflections; scattering parameters; simulation; solder bump; Assembly; Bonding; Coplanar waveguides; Frequency domain analysis; Joining processes; Microstrip; Packaging; Reflection; Scattering parameters; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1994., IEEE MTT-S International

Conference_Location

San Diego, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-1778-5

Type

conf

DOI

10.1109/MWSYM.1994.335111

Filename

335111