Title :
An L-band power amplifier multi-chip-module using multi-layered planar circuits
Author :
Ida, M. ; Suzaki, H. ; Yamanaka, T. ; Nishikawa, T.
Author_Institution :
Murata Manuf. Co. Ltd., Yokohama, Japan
Abstract :
A power amplifier Multi-Chip-Module (MCM) was developed for an L-band digital cordless telephone. To realize both the high power added efficiency and small outline, MMIC design in the MCM is combined with design of a multi-layered planar circuit. The maximum gain of 37.1 dB and output power of 25.6 dBm are obtained at 1.9 GHz. Maximum total power added efficiency is 25% at 2.0 GHz. A power added efficiency of a final stage power FET is estimated at 36%. An outline of 8.0/spl times/6.2/spl times/1.9 mm/sup 3/ is comparable with MMICs.<>
Keywords :
MMIC; cellular radio; cordless telephone systems; field effect integrated circuits; microwave amplifiers; mobile radio systems; multichip modules; power amplifiers; ultra-high-frequency amplifiers; 1.9 GHz; 25 to 36 percent; 37.1 dB; L-band; MMIC design; UHF; digital cordless telephone; final stage power FET; multi-chip-module; multi-layered planar circuits; output power; power added efficiency; power amplifier; small outline; Circuits; FETs; Gain; L-band; MMICs; Power amplifiers; Power generation; Telephony;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335125
