• DocumentCode
    2190589
  • Title

    Demonstration of fiber-based board-level optical clock distributions

  • Author

    Li, Y. ; Popelek, J. ; Rhee, J.-K. ; Wang, L.J. ; Wang, Ting ; Shum, Kai

  • Author_Institution
    NEC Res. Inst., Princeton, NJ, USA
  • fYear
    1998
  • fDate
    15-17 Jun 1998
  • Firstpage
    224
  • Lastpage
    228
  • Abstract
    Embedding of end-tapered, thin-cladding fiber bundles for board-level large bandwidth optical clock distributions is proposed and demonstrated. Fan-outs of up to 128-nodes on a printed circuit board of area as large as 13×19 cm2 are experimentally demonstrated. Both silica and polymer fibers were tested. Performance parameters, such as fiber bending loss, attenuations, dispersions, coupling loss and uniformity were measured. Embedding of fibers on a double-layered chip-populated real PCB was performed
  • Keywords
    optical fibre communication; parallel architectures; PCB; attenuations; coupling loss; dispersions; end-tapered; fiber bending loss; fiber bundles; optical clock distributions; thin-cladding fiber bundles; uniformity; Bandwidth; Circuit testing; Clocks; Optical attenuators; Optical fiber losses; Optical fiber testing; Optical fibers; Optical polymers; Printed circuits; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Massively Parallel Processing, 1998. Proceedings. Fifth International Conference on
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-8186-8572-7
  • Type

    conf

  • DOI
    10.1109/MPPOI.1998.682147
  • Filename
    682147
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2190589