DocumentCode :
2190944
Title :
Low-Power and High-Performance Communication Mechanism for Dependable Embedded Systems
Author :
Hanawa, Toshihiro ; Boku, Taisuke ; Miura, Shin Ichi ; Okamoto, Takayuki ; Sato, Mitsuhisa ; Arimoto, Kazutami
Author_Institution :
Center for Comput. Sci., Univ. of Tsukuba, Tsukuba, Japan
fYear :
2008
fDate :
21-23 Jan. 2008
Firstpage :
67
Lastpage :
73
Abstract :
Recently, a multi-core processor has been used to improve the performance and to reduce the power consumption. In order to acquire higher performance, multiprocessor connected with the network can enlarge the processing power. Dependability is also important for the embedded system to protect from a fault and failure. We develop a parallel platform for dependable embedded system, and investigate the low-power, reliable, and high-performance communication mechanism for such platform. In this study, we propose a communicator with communication links using PCI Express Gen2, and it denotes that maximum bandwidth is 2GB/s and several watts is required for power consumption. Moreover, this platform provides fault tolerance using redundancy.
Keywords :
embedded systems; fault tolerance; multiprocessing systems; parallel processing; peripheral interfaces; PCI Express Gen2; communication links; dependable embedded systems; fault tolerance; high-performance communication mechanism; low-power communication mechanism; multi-core processor; multiprocessor; parallel platform; power consumption; Bandwidth; Embedded computing; Embedded system; Energy consumption; Ethernet networks; Fault tolerance; Multicore processing; Peer to peer computing; Power system reliability; Systems engineering and theory; Low-power and High-performance network; PCI Express Gen2; dependable system;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Innovative Architecture for Future Generation High-Performance Processors and Systems (IWIA), 2008 International Workshop on
Conference_Location :
Hilo, HI
ISSN :
1537-3223
Print_ISBN :
978-1-4244-6465-4
Electronic_ISBN :
1537-3223
Type :
conf
DOI :
10.1109/IWIA.2008.8
Filename :
5453553
Link To Document :
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