DocumentCode
2192146
Title
Preliminary study on dependency of basic properties of porous silica ILD thin film on CMP compatibility
Author
Hanahata, H. ; Miyamoto, M. ; Kamata, T. ; Matsuno, S. ; Tanabe, T.
Author_Institution
Central Tech. Lab., Asahi Chem. Ind. Ltd., Shizuoka, Japan
fYear
2000
fDate
2000
Firstpage
61
Lastpage
63
Abstract
Adhesion, cohesive strength, modulus, and hardness of the porous silica ILD film via organic/inorganic hybrid (ALCAP-S) with various kinds of film thickness were investigated and the preliminary attempt was made to correlate the above properties with abrasion compatibility as a function of film thickness. The Stud-pull strength is drastically affected by the visco-elastic behavior of the film and necessary for correction. The corrected adhesion and cohesive strength of ALCAP-S (k=2.2) are satisfactorily high. With decreasing the film thickness, the depth-dependency of modulus induced by the substrate becomes more significant and the corresponding film is liable to abrasion. On the contrary, with increasing thickness the dependency ceases and the film appears to be more elastic, leading to lower abrasion compatibility
Keywords
abrasion; adhesion; chemical mechanical polishing; hardness; insulating thin films; porous materials; silicon compounds; ALCAP-S; CMP compatibility; SiO2; Stud-pull strength; adhesion; basic properties; cohesive strength; film thickness; hardness; modulus; organic/inorganic hybrid; porous silica ILD thin film; visco-elastic behavior; Adhesives; Elasticity; Laboratories; Mechanical factors; Nanoporous materials; Polymer films; Silicon compounds; Testing; Transistors; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location
Burlingame, CA
Print_ISBN
0-7803-6327-2
Type
conf
DOI
10.1109/IITC.2000.854282
Filename
854282
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