DocumentCode :
2192146
Title :
Preliminary study on dependency of basic properties of porous silica ILD thin film on CMP compatibility
Author :
Hanahata, H. ; Miyamoto, M. ; Kamata, T. ; Matsuno, S. ; Tanabe, T.
Author_Institution :
Central Tech. Lab., Asahi Chem. Ind. Ltd., Shizuoka, Japan
fYear :
2000
fDate :
2000
Firstpage :
61
Lastpage :
63
Abstract :
Adhesion, cohesive strength, modulus, and hardness of the porous silica ILD film via organic/inorganic hybrid (ALCAP-S) with various kinds of film thickness were investigated and the preliminary attempt was made to correlate the above properties with abrasion compatibility as a function of film thickness. The Stud-pull strength is drastically affected by the visco-elastic behavior of the film and necessary for correction. The corrected adhesion and cohesive strength of ALCAP-S (k=2.2) are satisfactorily high. With decreasing the film thickness, the depth-dependency of modulus induced by the substrate becomes more significant and the corresponding film is liable to abrasion. On the contrary, with increasing thickness the dependency ceases and the film appears to be more elastic, leading to lower abrasion compatibility
Keywords :
abrasion; adhesion; chemical mechanical polishing; hardness; insulating thin films; porous materials; silicon compounds; ALCAP-S; CMP compatibility; SiO2; Stud-pull strength; adhesion; basic properties; cohesive strength; film thickness; hardness; modulus; organic/inorganic hybrid; porous silica ILD thin film; visco-elastic behavior; Adhesives; Elasticity; Laboratories; Mechanical factors; Nanoporous materials; Polymer films; Silicon compounds; Testing; Transistors; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location :
Burlingame, CA
Print_ISBN :
0-7803-6327-2
Type :
conf
DOI :
10.1109/IITC.2000.854282
Filename :
854282
Link To Document :
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