Title :
Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films
Author :
Lee, Haebum ; Lopatin, Sergey D. ; Wong, S. Simon
Author_Institution :
Center for Integrated Syst., Stanford Univ., CA, USA
Abstract :
Electroplated Cu films with different plating conditions and different thickness are characterized during self- and thermal annealing. Faster recrystallization and stress development at room temperature are observed as the plating current density and film thickness are increased. Strong correlation between stress and texture behavior is found for all Cu films and is explained by the minimization of surface/interface energy and strain energy in anisotropic metal films
Keywords :
annealing; copper; electroplated coatings; internal stresses; metallic thin films; recrystallisation texture; surface energy; Cu; anisotropic metal film; electroplating; interface energy; recrystallization; self-annealing; strain energy; stress; surface energy; texture; thermal annealing; Anisotropic magnetoresistance; Annealing; Capacitive sensors; Copper; Current density; Electric resistance; Grain size; Optical films; Surface texture; Thermal stresses;
Conference_Titel :
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location :
Burlingame, CA
Print_ISBN :
0-7803-6327-2
DOI :
10.1109/IITC.2000.854298
