• DocumentCode
    2192827
  • Title

    The effects of surface contamination on resistance degradation of hot-switched low-force MEMS electrical contacts

  • Author

    Dickrell, Daniel J., III ; Dugger, Michael T.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    2005
  • fDate
    26-28 Sept. 2005
  • Firstpage
    255
  • Lastpage
    258
  • Abstract
    This work investigated the relationship between the resistance degradation in low-force metal contacts and hot-switched operational conditions representative of MEMS devices. A modified nano-indentation apparatus was used to bring electrically-biased gold and platinum surfaces into contact at a load of 100 μN. The applied normal force and electrical contact resistance of the contact materials was measured simultaneously. The influence of parallel discharge paths for stored electrical energy in the contact circuit is discussed in relation to surface contamination decomposition and the observed resistance degradation.
  • Keywords
    contact resistance; gold; micromechanical devices; nanocontacts; platinum; surface contamination; AuPt; MEMS devices; contact circuit; contact materials; electrical contact resistance; electrical energy; electrically-biased gold surface; electrically-biased platinum surface; hot-switched electrical contacts; hot-switched operational conditions; low-force metal contacts; modified nano-indentation apparatus; parallel discharge paths; resistance degradation; surface contamination decomposition; surface contamination effects; Contact resistance; Degradation; Electric resistance; Force measurement; Gold; Microelectromechanical devices; Micromechanical devices; Surface contamination; Surface discharges; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 2005. Proceedings of the Fifty-First IEEE Holm Conference on
  • Print_ISBN
    0-7803-9113-6
  • Type

    conf

  • DOI
    10.1109/HOLM.2005.1518252
  • Filename
    1518252