DocumentCode
2192827
Title
The effects of surface contamination on resistance degradation of hot-switched low-force MEMS electrical contacts
Author
Dickrell, Daniel J., III ; Dugger, Michael T.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2005
fDate
26-28 Sept. 2005
Firstpage
255
Lastpage
258
Abstract
This work investigated the relationship between the resistance degradation in low-force metal contacts and hot-switched operational conditions representative of MEMS devices. A modified nano-indentation apparatus was used to bring electrically-biased gold and platinum surfaces into contact at a load of 100 μN. The applied normal force and electrical contact resistance of the contact materials was measured simultaneously. The influence of parallel discharge paths for stored electrical energy in the contact circuit is discussed in relation to surface contamination decomposition and the observed resistance degradation.
Keywords
contact resistance; gold; micromechanical devices; nanocontacts; platinum; surface contamination; AuPt; MEMS devices; contact circuit; contact materials; electrical contact resistance; electrical energy; electrically-biased gold surface; electrically-biased platinum surface; hot-switched electrical contacts; hot-switched operational conditions; low-force metal contacts; modified nano-indentation apparatus; parallel discharge paths; resistance degradation; surface contamination decomposition; surface contamination effects; Contact resistance; Degradation; Electric resistance; Force measurement; Gold; Microelectromechanical devices; Micromechanical devices; Surface contamination; Surface discharges; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 2005. Proceedings of the Fifty-First IEEE Holm Conference on
Print_ISBN
0-7803-9113-6
Type
conf
DOI
10.1109/HOLM.2005.1518252
Filename
1518252
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