DocumentCode :
2192877
Title :
Finite element analysis of magnetic structures for micro-electro-mechanical relays
Author :
Wanbin, Ren ; Guofu, Zhai ; Qiya, Wang ; Desheng, Li
Author_Institution :
Harbin Inst. of Technol., China
fYear :
2005
fDate :
26-28 Sept. 2005
Firstpage :
265
Lastpage :
269
Abstract :
Micro-electro-mechanical system technology offers great promise in addressing the need for smaller electromechanical relays, and may bridge the performance and economic gaps between conventional electromechanical technology and solid state devices. It is necessary for electromagnetic field analysis during design process of micro-electro-mechanical relay. Planar coil and magnetic plate structures were modeled by using finite element method in this paper. Furthermore the open domain magnetic field views of micro-electro-mechanical relay with different structures were compared. And the electromagnetic attraction force of movable contacts in MEMS relay was analyzed, thus can not only simplify the fabrication procedure, but also develop the working performance of products. The results of the analysis can be useful for designers to develop optimal magnetic structure of micro-electro-mechanical relays.
Keywords :
coils; electromagnetic fields; finite element analysis; magnetic domains; magnetic fields; magnetic structure; microrelays; MEMS relay; electromagnetic attraction force; electromagnetic field analysis; electromechanical relays; electromechanical technology; finite element analysis; magnetic plate structures; magnetic structures; microelectromechanical relays; microelectromechanical systems; movable contacts; open domain magnetic field; optimal magnetic structure; planar coil structures; solid state devices; Bridge circuits; Coils; Electromagnetic analysis; Electromagnetic fields; Finite element methods; Magnetic analysis; Microelectromechanical systems; Process design; Relays; Solid state circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts, 2005. Proceedings of the Fifty-First IEEE Holm Conference on
Print_ISBN :
0-7803-9113-6
Type :
conf
DOI :
10.1109/HOLM.2005.1518254
Filename :
1518254
Link To Document :
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