Rapid thermal modeling for smart-power and integrated multichip power circuit design

Author

Dupuy, P. ; Dorkel, J.M. ; Tounsi, P. ; Borucki, L.

Author_Institution

Lab. d´´Anal. et d´´Archit. des Syst., CNRS, Toulouse, France

fYear

1996

fDate

20-23 May 1996

Firstpage

173

Lastpage

176

Abstract

This paper recalls how the two-port network theory can be introduced to solve the 3D heat flow equation in a multilayered plane structure. In this paper we present two pieces of software based on the application of this theory, which are used to analyze the thermal behavior of SmartMos circuits with a fairly good accuracy and short computational times. Finally, an illustration is given and some comparisons are made with experiments and an FE code

Keywords

circuit CAD; circuit analysis computing; integrated circuit design; integrated circuit modelling; integrated circuit packaging; multichip modules; power integrated circuits; thermal analysis; transient analysis; 3D heat flow equation; SMODTHERM; SmartMos circuits; TMODTHERM; integrated multichip power circuit; multilayered plane structure; rapid thermal modeling; smart-power circuit; thermal behavior analysis; two-port network theory; Circuit synthesis; Computer networks; Distributed computing; Equations; Fourier transforms; Power dissipation; Steady-state; Temperature distribution; Thermal resistance; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs, 1996. ISPSD '96 Proceedings., 8th International Symposium on

Conference_Location

Maui, HI

ISSN

1063-6854

Print_ISBN

0-7803-3106-0

Type

conf

DOI

10.1109/ISPSD.1996.509474

Filename

509474