Determination of area-array bond pitch for optimum MCM systems: a case study

Author

Dehkordi, Peyman ; Ramamurthi, Karthi ; Bouldin, Donald ; Davidson, Howard

Author_Institution

Tennessee Univ., Knoxville, TN, USA

fYear

1997

fDate

4-5 Feb 1997

Firstpage

8

Lastpage

12

Abstract

Microelectronics system designers need to understand and evaluate the impact of advanced packaging parameters which have become an integral part of microelectronics systems. This paper evaluates the impact of bond pitch for a flipchip multichip system through a case study. The SUN MicroSparc CPU was used as a representative of a large design where the design has to be partitioned and interconnected using MCM technology. Early analysis techniques were used to analyze the design for various pitches ranging from 150 to 400 micron in 50 micron increments. Results suggest that various bond pitches affect the system cost/performance and there is a minimum pitch at which lowering the pitch will degrade the cost/performance metrics

Keywords

fine-pitch technology; flip-chip devices; integrated circuit packaging; multichip modules; 150 to 400 micron; MCM; SUN MicroSparc CPU; area-array bond pitch; flipchip multichip system; microelectronics system design; optimum system; packaging; Bonding; Computer aided software engineering; Costs; Degradation; Design optimization; Measurement; Microelectronics; Packaging; Routing; Sun;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-7789-9

Type

conf

DOI

10.1109/MCMC.1997.569338

Filename

569338