Title :
A hybrid-circuit tile-approach architecture for high-power spatial power-combined transmitters
Author :
Gouker, M.A. ; Beaudette, R.G. ; Delisle, J.T.
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
Abstract :
A new architecture for spatial power combining is presented. This design addresses the issues of high reliability/thermal management, maximizing combining efficiency, and maximizing graceful degradation. The design has been tested with the construction of a brassboard 4-by-4 subarray at 10 GHz. The measured results show an EIRP of 25.0 dBW (315 W), output power greater than 4 W, and a dc-to-RF conversion efficiency greater than 18%.<>
Keywords :
MMIC; circuit reliability; hybrid integrated circuits; radio transmitters; waveguide components; 10 GHz; 18 percent; 315 W; 4 W; DC-to-RF conversion efficiency; EIRP; brassboard 4-by-4 subarray; design; graceful degradation; high-power spatial power-combined transmitters; hybrid-circuit tile-approach architecture; output power; reliability; thermal management; Power generation; Power measurement; Testing; Thermal degradation; Thermal management;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335280
