DocumentCode
2193500
Title
A computationally efficient method for modeling circuits housed in non-rectangular packages
Author
Ferry, R.M. ; Dunn, J.M. ; Booton, R.C., Jr.
Author_Institution
MIMICAD Center, Colorado Univ., Boulder, CO, USA
fYear
1994
fDate
23-27 May 1994
Firstpage
1527
Abstract
Mathematical difficulties make a solution for parasitic impedances in packaged microstrip circuits problematic. Because of this, most present simulators model rectangular packages. In this paper, a method developed for rectangular packages is generalized to model packages with other cross sections. Reasonable accuracy is shown for a computationally efficient simulation of circuits housed in a package with trapezoidal cross section.<>
Keywords
circuit analysis computing; electric impedance; microstrip components; microwave circuits; packaging; computationally efficient method; modeling; nonrectangular packages; packaged microstrip circuits; parasitic impedances; simulation; trapezoidal cross section; Circuit simulation; Computational modeling; Impedance; Microstrip; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location
San Diego, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1778-5
Type
conf
DOI
10.1109/MWSYM.1994.335284
Filename
335284
Link To Document