Title :
A computationally efficient method for modeling circuits housed in non-rectangular packages
Author :
Ferry, R.M. ; Dunn, J.M. ; Booton, R.C., Jr.
Author_Institution :
MIMICAD Center, Colorado Univ., Boulder, CO, USA
Abstract :
Mathematical difficulties make a solution for parasitic impedances in packaged microstrip circuits problematic. Because of this, most present simulators model rectangular packages. In this paper, a method developed for rectangular packages is generalized to model packages with other cross sections. Reasonable accuracy is shown for a computationally efficient simulation of circuits housed in a package with trapezoidal cross section.<>
Keywords :
circuit analysis computing; electric impedance; microstrip components; microwave circuits; packaging; computationally efficient method; modeling; nonrectangular packages; packaged microstrip circuits; parasitic impedances; simulation; trapezoidal cross section; Circuit simulation; Computational modeling; Impedance; Microstrip; Packaging;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335284
