Title :
Cleaning process strategies compatible with low-k dielectric and copper: state of the art, evolution and perspectives
Author :
Louis, D. ; Beverina, A. ; Arvet, C. ; Lajoinie, E. ; Peyne, C. ; Holmes, D. ; Maloney, D. ; Lee, Sang-Rim ; Lee, S.
Author_Institution :
CEA-LETI, Grenoble, France
Abstract :
This work presents an analysis of interconnect cleaning for low-k/copper integration. Analytical and electrical data are combined to understand the mechanisms and efficacy of various available cleaning chemistries in the presence of Cu and organic, Si-based, and hybrid dielectrics
Keywords :
copper; dielectric thin films; integrated circuit interconnections; surface cleaning; Cu; cleaning process; copper interconnect; low-k dielectric film; Chemistry; Cleaning; Copper; Data analysis; Dielectrics; Dry etching; Microelectronics; Surface contamination; Telecommunications; Wet etching;
Conference_Titel :
Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International
Conference_Location :
Burlingame, CA
Print_ISBN :
0-7803-6327-2
DOI :
10.1109/IITC.2000.854339
