Title :
Thermally-enhanced SOIC packages for power IC devices
Author :
Chowdhury, Asif ; Guenin, Bruce M. ; Groover, Richard ; Anderson, Steve ; Derian, Edward J.
Author_Institution :
Adv. Packaging, Amkor Electron. Inc., Chandler, AZ, USA
Abstract :
Different design techniques to improve the thermal performance of a standard SOIC package have been evaluated and their thermal performance compared through thermal models by utilizing finite element analysis. It is shown that by enhancing the design of a standard SOIC package the thermal performance can be improved by as much as 46% over that of the standard design
Keywords :
circuit analysis computing; economics; finite element analysis; integrated circuit design; integrated circuit manufacture; integrated circuit modelling; integrated circuit packaging; power integrated circuits; chip on lead package; cost; finite element analysis; heat slug package; manufacturability; power IC devices; thermal models; thermal performance; thermally-enhanced SOIC packages; Consumer electronics; Electronic packaging thermal management; Integrated circuit packaging; Lead; Personal digital assistants; Power integrated circuits; Semiconductor device packaging; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Power Semiconductor Devices and ICs, 1996. ISPSD '96 Proceedings., 8th International Symposium on
Conference_Location :
Maui, HI
Print_ISBN :
0-7803-3106-0
DOI :
10.1109/ISPSD.1996.509505
