Title :
High speed 15 ns 4 Mbit SRAM for space application
Author :
Coloma, Bernard ; Delaunay, Patrick ; Husson, Olivier
Abstract :
A high speed 15 ns 4 Mbit asynchronous SRAM, 500 μA stand-by current, 300 krad total dose tolerant, has been developed for space applications, using a hardened 0.25 micron 4 layers metal full CMOS process. A hierarchical organisation per IO bits has been used to achieve high speed as well as low dynamic consumption, also suited for simple SEU (single event upset) induced error corrections, allowing mitigation with classical EDAC corrector. The product operates within 3 to 3.6 V, and ambient temperature from -55 to +125°C. A high density die size of 68.3 mm2 allows the use of a specific 36-pins dual in line flat pack package with a 500 mil width, making this product very competitive against SEU hardened chips. Successful silicon results are presented as well as radiation tests up to 300 krad.
Keywords :
CMOS memory circuits; asynchronous circuits; high-speed integrated circuits; integrated circuit packaging; integrated circuit testing; life testing; radiation hardening (electronics); space vehicle electronics; -55 to 125 degC; 0.25 micron; 15 ns; 3 to 3.6 V; 300 krad; 4 Mbit; 500 mil; 500 muA; EDAC corrector; SEU; Si; ambient temperature; asynchronous SRAM; dual in line flat pack package; dynamic consumption; error corrections; full CMOS process; hierarchical organisation; high density die size; high speed; radiation tests; space application; total dose tolerance; CMOS process; Circuits; Clocks; Decoding; Latches; Photonic band gap; Random access memory; Regulators; Single event upset; Voltage control;
Conference_Titel :
Memory Technology, Design and Testing, 2002. (MTDT 2002). Proceedings of the 2002 IEEE International Workshop on
Print_ISBN :
0-7695-1617-3
DOI :
10.1109/MTDT.2002.1029760