• DocumentCode
    2194696
  • Title

    Automatic Removal of Ocular Artifacts from EEG Signals

  • Author

    Gao, Junfeng ; Zheng, Chongxun ; Wang, Pei

  • Author_Institution
    Key Lab. of Biomed. Inf. Eng. of Educ. Minist., Xi´´an Jiaotong Univ., Xi´´an, China
  • fYear
    2009
  • fDate
    17-19 Oct. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Electroencephalogram (EEG) signals are often contaminated by ocular artifacts. In present study, a novel and robust technique is presented to eliminate ocular artifacts from EEG signals automatically. Independent component analysis (ICA) method is used to decompose EEG signals. In the first step, the features of topography and power spectral density of those components are extracted. In the second step, we introduce manifold learning algorithm to reduce the dimensionality of initial features. Then, a classifier is used to identify ocular artifacts components. The classifier is selected from several typical classifiers by comparing their classification performances. Classification results show that manifold learning with the nearest neighbor algorithm performs best. Finally, using an example of ocular artifacts removal, we show that the novel technique can effectively remove ocular artifacts with little distortion of underlying brain signals.
  • Keywords
    electro-oculography; electroencephalography; independent component analysis; learning (artificial intelligence); medical signal processing; signal classification; EEG signals; automatic removal; brain; classification; electroencephalogram signals; electrooculography; independent component analysis; manifold learning algorithm; nearest neighbor algorithm; ocular artifacts; power spectral density; topography; Biomedical engineering; Data mining; Electroencephalography; Electrooculography; Independent component analysis; Nearest neighbor searches; Principal component analysis; Robustness; Source separation; Surfaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Engineering and Informatics, 2009. BMEI '09. 2nd International Conference on
  • Conference_Location
    Tianjin
  • Print_ISBN
    978-1-4244-4132-7
  • Electronic_ISBN
    978-1-4244-4134-1
  • Type

    conf

  • DOI
    10.1109/BMEI.2009.5305540
  • Filename
    5305540