Title :
A general purpose 3D electromagnetic simulation and optimization package-IE3D
Author :
Jian-Xiong Zheng
Author_Institution :
Zeland Software Inc., San Francisco, CA, USA
Abstract :
A general purpose electromagnetic simulation and optimization package IE3D has been developed for the analysis and design of planar and 3D structures encountered in microwave and millimeter-wave integrated circuits (MMIC), high temperature superconductor (HTS) circuits, microstrip antennas, RF printed circuit boards (PCB) and high speed digital circuit packaging. Based upon an integral equation, method of moment algorithm, the simulator can accurately and efficiently simulate arbitrarily shaped and oriented 3D metallic structures in multi-layer dielectric substrates. The simulator is interfaced with standard MS-Windows based layout editor, schematic editor and post processor. The IE3D simulation results compared with measured results are presented in this paper.<>
Keywords :
circuit layout CAD; digital simulation; high-temperature superconductors; integral equations; microstrip antennas; microwave integrated circuits; numerical analysis; packaging; printed circuits; software packages; superconducting integrated circuits; superconducting microwave devices; 3D electromagnetic simulation; 3D structures; IE3D; MS-Windows based layout editor; RF printed circuit boards; electromagnetic package; high speed digital circuit packaging; high temperature superconductor circuits; integral equation; metallic structures; method of moment algorithm; microstrip antennas; microwave integrated circuits; millimeter-wave integrated circuits; multi-layer dielectric substrates; planar structures; schematic editor; Analytical models; Circuit simulation; Design optimization; Electromagnetic analysis; High temperature superconductors; Integrated circuit packaging; MMICs; Microstrip antennas; Microwave antennas; Millimeter wave integrated circuits;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335410
