Title :
0.4-8 GHz broadband MMICs in novel RF chip size package for optical video distribution system
Author :
Fujimoto, K. ; Kawashima, K. ; Nishitsuji, M. ; Nobori, K. ; Nagata, H. ; Ishikawa, O.
Author_Institution :
Semiconductor Device Res. Center, Matsushita Electron. Corp., Osaka, Japan
Abstract :
0.4-8 GHz broadband MMICs in the novel RF chip size package (RF-CSP) have been developed for the optical video distribution system. By using anisotropic conductive film (ACF) for the flip-chip bonding, fabrication process of RF-CSP becomes very simple and cost effective. This RF-CSP is one of the smallest packages ever reported.
Keywords :
MMIC; chip scale packaging; flip-chip devices; frequency modulation; microwave photonics; multimedia communication; optical fibre subscriber loops; optical modulation; video signals; 0.4 to 8 GHz; CSP; RF chip size package; anisotropic conductive film; broadband MMICs; flip-chip bonding; optical video distribution system; Anisotropic conductive films; Bonding; Frequency modulation; Integrated circuit interconnections; MMICs; Optical network units; Packaging; Plastics; Radio frequency; Wideband;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2000. Digest of Papers. 2000 IEEE
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-6280-2
DOI :
10.1109/RFIC.2000.854439
