Title :
Fast extraction of the capacitance matrix of multilayered multiconductor interconnects using the method of lines
Author :
Jiang, Xiaohong ; Wu, Ke ; Hong, Wei ; Dai, Wayne Wei-Ming
Author_Institution :
Dept. of Electr. & Comput. Eng., Ecole Polytech. de Montreal, Que., Canada
Abstract :
In this paper, the method of lines (MoL) is used to compute the 2-D and 3-D capacitance matrices of multiconductor interconnects with finite metalization thickness that are embedded in conformal multilayered dielectric media. Results show a good agreement with the published data. By contrast, this technique has efficient calculation and flexible handling of conductors having arbitrarily shaped topology
Keywords :
capacitance; conductors (electric); integrated circuit interconnections; metallisation; multichip modules; time-domain analysis; MoL; arbitrarily shaped conductor topology; capacitance matrix; conformal multilayered dielectric media; finite metalization thickness; method of lines; multilayered multiconductor interconnects; Capacitance; Conductors; Dielectrics; Embedded computing; Finite difference methods; Integrated circuit interconnections; Laplace equations; Magnetic analysis; Maxwell equations; Transmission line matrix methods;
Conference_Titel :
Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7789-9
DOI :
10.1109/MCMC.1997.569351
