Fast extraction of the capacitance matrix of multilayered multiconductor interconnects using the method of lines

Author

Jiang, Xiaohong ; Wu, Ke ; Hong, Wei ; Dai, Wayne Wei-Ming

Author_Institution

Dept. of Electr. & Comput. Eng., Ecole Polytech. de Montreal, Que., Canada

fYear

1997

fDate

4-5 Feb 1997

Firstpage

98

Lastpage

101

Abstract

In this paper, the method of lines (MoL) is used to compute the 2-D and 3-D capacitance matrices of multiconductor interconnects with finite metalization thickness that are embedded in conformal multilayered dielectric media. Results show a good agreement with the published data. By contrast, this technique has efficient calculation and flexible handling of conductors having arbitrarily shaped topology

Keywords

capacitance; conductors (electric); integrated circuit interconnections; metallisation; multichip modules; time-domain analysis; MoL; arbitrarily shaped conductor topology; capacitance matrix; conformal multilayered dielectric media; finite metalization thickness; method of lines; multilayered multiconductor interconnects; Capacitance; Conductors; Dielectrics; Embedded computing; Finite difference methods; Integrated circuit interconnections; Laplace equations; Magnetic analysis; Maxwell equations; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-7789-9

Type

conf

DOI

10.1109/MCMC.1997.569351

Filename

569351