DocumentCode
2196381
Title
Cooling rate dependence of microstructure and thermoelectric properties of AgPb18 SbTe20 compounds
Author
Yan, Yonggao ; Tang, Xinfeng ; Liu, Haijun ; Yin, Lingling ; Zhang, Qingjie
Author_Institution
State Key Lab. of Adv. Technol. for Mater. Synthesis & Process., Wuhan Univ. of Technol., Wuhan
fYear
2007
fDate
3-7 June 2007
Firstpage
61
Lastpage
63
Abstract
AgPb18SbTe20 samples were prepared by cooling from melts at three different rates as quenching, furnace cooling and controlled slow cooling rate of 10degC /h, and the correlation between cooling rates and samples microstructure and thermoelectric properties were discussed. Experimental results show that cooling rates influence significantly the microstructure and thermoelectric properties of the samples. As the cooling rate increased, an Ag-Sb-rich second phase occurred. Samples carrier concentration and electrical conductivity decrease with increased cooling rates and all samples measured have a negative Seebeck coefficient showing n-type conduction. At room temperature, the power factor of the slow cooled sample is 100 times that of the quench samples, and the ZT value of furnace cooled samples is much higher than that of the quenched samples. This results may explain why the samples several researchers prepared by different synthesis processes show very different ZT values.
Keywords
Seebeck effect; antimony compounds; carrier density; crystal microstructure; electrical conductivity; lead compounds; melt processing; quenching (thermal); silver compounds; thermoelectric power; AgPb18SbTe20; Seebeck coefficient; ZT value; carrier concentration; cooling rate; electrical conductivity; furnace cooling; microstructure property; n-type conduction; power factor; quenching; slow cooling; temperature 293 K to 298 K; thermoelectric property; Conducting materials; Cooling; Furnaces; Microstructure; Plasma properties; Plasma temperature; Powders; Temperature dependence; Thermoelectricity; X-ray scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location
Jeju Island
ISSN
1094-2734
Print_ISBN
978-1-4244-2262-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2007.4569423
Filename
4569423
Link To Document