• DocumentCode
    2196405
  • Title

    Effect of annealing treatment on thermoelectric properties of n-type Bi-Te-Se sintered materials

  • Author

    Jiang, Jun ; Li, Yali ; Xu, Gaojie ; Cui, Ping ; Chen, Lidong

  • Author_Institution
    Ningbo Inst. of Mater. Technol. & Eng., Chinese Acad. of Sci., Ningbo
  • fYear
    2007
  • fDate
    3-7 June 2007
  • Firstpage
    64
  • Lastpage
    66
  • Abstract
    In this study, n-type Bi-Te-Se crystals were prepared by the zone melting (ZM) method and bulk materials with high bending strength were fabricated by ZM followed by spark plasma sintering (SPS) technique. The annealing treatment was then carried out at 593 K with holding time of 36 hr for the sintered materials. Thermoelectric properties, including Seebeck coefficient (alpha), electrical conductivity (sigma) and thermal conductivity (kappa) were measured in the temperature range of 300-500 K. The results showed the maximum figure of merit (ZT = alpha2sigmaT/kappa) of 0.79 was obtained for the n-type Bi-Te-Se material through the annealing treatment, which was very close to that of the zone-melted crystal.
  • Keywords
    Seebeck effect; annealing; bending strength; bismuth alloys; crystal growth from melt; electrical conductivity; plasma materials processing; selenium alloys; sintering; tellurium alloys; thermal conductivity; zone melting; BiSeTe; Seebeck coefficient; annealing; bending strength; bulk materials; electrical conductivity; n-type sintered crystals; spark plasma sintering; temperature 300 K to 500 K; temperature 593 K; thermal conductivity; thermoelectric property; time 36 hr; zone melting; Annealing; Conducting materials; Crystalline materials; Crystals; Plasma measurements; Plasma temperature; Sparks; Temperature measurement; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2007. ICT 2007. 26th International Conference on
  • Conference_Location
    Jeju Island
  • ISSN
    1094-2734
  • Print_ISBN
    978-1-4244-2262-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2007.4569424
  • Filename
    4569424