Title :
Environmental Conservation Through Lead-Free Electronics Manufacturing
Author :
Ng, Siu-Lung ; Vaidya, Amit ; Venkataraman, Vivek ; Murcko, Bob ; Srihari, Krishnaswami ; Rai, Raj
Author_Institution :
Syst. Sci. & Ind. Eng., State Univ. of New York, Binghamton, NY
Abstract :
This paper discusses a research project to reduce and subsequently eliminate environmentally hazardous materials at a particular electronics manufacturer. In working with this industrial partner (a manufacturer of substrates and printed circuit board assemblies), the goal was to find a suitable lead-free alternative to the present SnPb alloy and also identify alternative lead free components. This strategy can serve as a blueprint for similar initiatives across the electronics manufacturing service (or EMS) provider spectrum. The evaluation and selection of a solder paste is extremely important and literature is replete with articles that address the critical nature of solder paste and its affect on yield and solder joint reliability
Keywords :
electronics industry; environmental economics; hazardous materials; solders; environmental conservation; hazardous materials; lead free solder; lead-free electronics manufacturing; solder joint reliability; solder paste; Assembly; Batteries; Circuit testing; Consumer electronics; Electronic equipment manufacture; Environmentally friendly manufacturing techniques; Hazardous materials; Industrial electronics; Lead; Pulp manufacturing;
Conference_Titel :
Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0351-0
DOI :
10.1109/ISEE.2006.1650059
