Environmental Conservation Through Lead-Free Electronics Manufacturing

Author

Ng, Siu-Lung ; Vaidya, Amit ; Venkataraman, Vivek ; Murcko, Bob ; Srihari, Krishnaswami ; Rai, Raj

Author_Institution

Syst. Sci. & Ind. Eng., State Univ. of New York, Binghamton, NY

fYear

2006

fDate

8-11 May 2006

Firstpage

189

Lastpage

194

Abstract

This paper discusses a research project to reduce and subsequently eliminate environmentally hazardous materials at a particular electronics manufacturer. In working with this industrial partner (a manufacturer of substrates and printed circuit board assemblies), the goal was to find a suitable lead-free alternative to the present SnPb alloy and also identify alternative lead free components. This strategy can serve as a blueprint for similar initiatives across the electronics manufacturing service (or EMS) provider spectrum. The evaluation and selection of a solder paste is extremely important and literature is replete with articles that address the critical nature of solder paste and its affect on yield and solder joint reliability

Keywords

electronics industry; environmental economics; hazardous materials; solders; environmental conservation; hazardous materials; lead free solder; lead-free electronics manufacturing; solder joint reliability; solder paste; Assembly; Batteries; Circuit testing; Consumer electronics; Electronic equipment manufacture; Environmentally friendly manufacturing techniques; Hazardous materials; Industrial electronics; Lead; Pulp manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on

Conference_Location

Scottsdale, AZ

ISSN

1095-2020

Print_ISBN

1-4244-0351-0

Type

conf

DOI

10.1109/ISEE.2006.1650059

Filename

1650059