Title :
Technological Use Histories for Solder Metals
Author :
Graedel, T.E. ; Dong, J. ; Jiansu, Mao
Author_Institution :
Center for Ind. Ecology, Yale Univ., New Haven, CT
Abstract :
Legislation in Europe as well as industry and consumer pressure has caused a shift from traditional tin-lead solder to lead-free solder. In this work, we examine five metals used or contemplated for use in electronic solders: tin and lead (the traditional solder metals), copper and silver (the metals added to tin in most non-leaded solders), and bismuth (a constituent of some specialty solders). History of use, current use, and potential effects of a transition to lead-free solder are the main topics of discussion
Keywords :
bismuth; copper; lead; solders; tin; Ag; Bi; Cu; Europe; Pb; Sn; bismuth; consumer pressure; copper; industry pressure; lead-free solder; legislation; silver; solder metals; tin-lead solder; Batteries; Cable shielding; Copper; Environmentally friendly manufacturing techniques; Europe; History; Lead; Production; Silver; Tin;
Conference_Titel :
Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
Conference_Location :
Scottsdale, AZ
Print_ISBN :
1-4244-0351-0
DOI :
10.1109/ISEE.2006.1650061
