DocumentCode :
2197042
Title :
An Environmentally Benign Process Model Development for Printed Circuit Board Recycling
Author :
Zhang, Hong-Chao ; Ouyang, Xi ; Abadi, Alex
Author_Institution :
Dept. of Ind. Eng., Texas Tech Univ., Lubbock, TX
fYear :
2006
fDate :
8-11 May 2006
Firstpage :
212
Lastpage :
217
Abstract :
Delaminating and separation of obsolete printed circuit board (PCB) is essential for its recycling. This paper presents an alternative environmentally benign process method for PCB recycling. Applying the solvent system, e.g. carbon dioxide and water under certain pressure and temperature, the PCB scraps could be delaminated easily. The separation of PCB into copper foil, glass fiber and polymer will be beneficial for further PCB recycling. The fundamental experiment mechanism is based on the polymer physics and polymerization. When the process temperature is raised above the polymer glass transition temperature Tg, polymer would be decomposed, which caused the main bonding force among PCB layers greatly reduced. Base on this principle several different processing circumstances were explored, including supercritical carbon dioxide; binary solvent system of CO2 and H2O; trinary solvent system of CO2, H2O and CH3CH 2OH. The experiment facilities were set up and the input & output parameters were defined to evaluate the PCB delaminating result. Utility functions were developed to optimize the process conditions. The recommendations for future study are illustrated at the end of this paper
Keywords :
electronics industry; polymerisation; polymers; printed circuit manufacture; recycling; scrap metal; CO2; H2O; PCB scraps; binary solvent system; bonding force; copper foil; delamination; environmentally benign process model development; glass fiber; polymer physics; polymerization; printed circuit board recycling; supercritical carbon dioxide; trinary solvent system; Carbon dioxide; Copper; Glass; Physics; Polymers; Printed circuits; Recycling; Solvents; Temperature; Water conservation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on
Conference_Location :
Scottsdale, AZ
ISSN :
1095-2020
Print_ISBN :
1-4244-0351-0
Type :
conf
DOI :
10.1109/ISEE.2006.1650063
Filename :
1650063
Link To Document :
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