Characterization of RF/microwave packaging structures

Author

Cyrusian, S. ; Fotheringham, G.

Author_Institution

Res. Center for Microperipheric Technol., Tech. Univ. of Berlin, Germany

Volume

1

fYear

1995

fDate

24-27 Jul 1995

Firstpage

335

Abstract

Various RF/microwave packaging structures are investigated by a numerical full wave analysis. In frequency ranges up to 80 GHz chip contacting methods are characterized. Coplanar waveguide-to-coax and -to-microstrip and coax-to-microstrip transitions are treated. Optimization and sensitivity curves are given. The simulation results can be used for introducing some standard RF/microwave packaging structures

Keywords

circuit analysis computing; coaxial cables; coplanar waveguides; integrated circuit packaging; microstrip lines; microwave integrated circuits; numerical analysis; optimisation; sensitivity; 80 GHz; RF/microwave packaging structures; chip contacting methods; coax-to-microstrip transitions; coplanar waveguide-to-coax transitions; coplanar waveguide-to-microstrip transitions; frequency ranges; numerical full wave analysis; optimization curves; sensitivity curves; simulation results; Bonding; Coaxial components; Connectors; Coplanar waveguides; Magnetic materials; Packaging; Radio frequency; Substrates; Waveguide transitions; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Optoelectronics Conference, 1995. Proceedings., 1995 SBMO/IEEE MTT-S International

Conference_Location

Rio de Janeiro

Print_ISBN

0-7803-2674-1

Type

conf

DOI

10.1109/SBMOMO.1995.509642

Filename

509642