DocumentCode
2197210
Title
Thermoelectric properties of Inz Co4 Sb12-y Tey skutterudites
Author
Jung, J.-Y. ; Hong, S.-J. ; You, S.-W. ; Jeong, Y.-J. ; Lee, J.-I. ; Ur, S.-C. ; Kim, I.-H.
Author_Institution
Dept. of Mater. Sci. & Eng./RIC-ReSEM, Chungju Nat. Univ., Chungju
fYear
2007
fDate
3-7 June 2007
Firstpage
203
Lastpage
206
Abstract
In-filled and Te-doped CoSb3 skutterudites were prepared by encapsulated induction melting, and their thermoelectric properties were investigated from 300 K to 700 K. Single delta-phase was successfully obtained by the subsequent heat treatment at 823 K for 5 days. In-filled and Te-doped InzCo4Sb12-yTey showed the n-type conduction at all temperatures examined, indicating that Te atoms successfully acted as electron donors by substituting Sb atoms. Electrical resistivity was reduced by In filling and Te doping, and the Te doping effect on the resistivity decrease was predominant. Thermal conductivity was considerably reduced by In filling as well as Te doping due to the increase in phonon scattering, which shows that the lattice thermal conductivity is much larger than the electronic thermal conductivity in the InzCo4Sb12-yTey systems.
Keywords
Seebeck effect; antimony compounds; cobalt compounds; doping; electrical resistivity; indium compounds; melting; phonons; semiconductor materials; thermal conductivity; InzCo4Sb12-yTey; Seebeck coefficient; delta-phase; doping; electrical resistivity; electron donors; electronic thermal conductivity; encapsulated induction melting; lattice thermal conductivity; n-type conduction; phonon scattering; skutterudites; temperature 300 K to 700 K; temperature 823 K; thermoelectric properties; time 5 day; Doping; Electric resistance; Electrons; Filling; Heat treatment; Phonons; Tellurium; Temperature; Thermal conductivity; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location
Jeju Island
ISSN
1094-2734
Print_ISBN
978-1-4244-2262-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2007.4569459
Filename
4569459
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