Title :
Electronic transport properties of InzCo4Sb12-yTey skutterudites
Author :
Jung, J.-Y. ; Han, K.-J. ; Lee, J.-K. ; Kwon, J.-C. ; Lee, J.-I. ; Ur, S.-C. ; Kim, I.-H.
Author_Institution :
Dept. of Mater. Sci. & Eng./RIC-ReSEM, Chungju Nat. Univ., Chungju
Abstract :
InzCo4Sb12-yTey skutterudites were prepared by encapsulated induction melting and their electronic transport properties were investigated. Single phase delta-CoSb3 was successfully obtained by the encapsulated induction melting and subsequent heat treatment at 823 K for 5 days. Te atoms acted as electron donors by substituting Sb atoms. The Hall coefficient and the Seebeck coefficient showed negative values, which confirms that InzCo4Sb12-yTey skutterudites are n-type semiconductors. Electronic transport properties were considerably affected by Te doping rather than In filling. Carrier concentration was in the range of 7 times 1019 to 4 times 1020 cm-3, and carrier mobility was 2 to 22 cm2/Vs. The Seebeck coefficient negatively decreased and the electrical resistivity decreased by Te doping and In filling. The thermal conductivity was considerably reduced by doping as well as filling due to the phonon scattering, which is responsible for the lattice thermal conductivity reduction.
Keywords :
Hall effect; Seebeck effect; antimony compounds; carrier mobility; cobalt compounds; heat treatment; indium compounds; phonons; semiconductor doping; semiconductor materials; thermal conductivity; Hall coefficient; InCo4Sb12Te; Seebeck coefficient; carrier concentration; carrier mobility; doping; electron donors; electronic transport properties; encapsulated induction melting; lattice thermal conductivity reduction; phonon scattering; temperature 823 K; thermal conductivity; time 5 day; Electric resistance; Electrons; Filling; Heat treatment; Lattices; Phonons; Scattering; Semiconductor device doping; Tellurium; Thermal conductivity;
Conference_Titel :
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location :
Jeju Island
Print_ISBN :
978-1-4244-2262-3
Electronic_ISBN :
1094-2734
DOI :
10.1109/ICT.2007.4569460