• DocumentCode
    2197531
  • Title

    Filling dependence of thermoelectric power in transition-metal monosilicides

  • Author

    Sakai, A. ; Yotsuhashi, S. ; Adachi, H. ; Ishii, F. ; Onose, Y. ; Tomioka, Y. ; Nagaosa, N. ; Tokura, Y.

  • Author_Institution
    Correlated Electron Res. Center, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba
  • fYear
    2007
  • fDate
    3-7 June 2007
  • Firstpage
    256
  • Lastpage
    259
  • Abstract
    We have investigated temperature and electron-number (band-filling) dependence of Seebeck coefficient in B20-type transition-metal monosilicides experimentally to gain the systematics of thermoelectric properties. This can lead to a perspective on the materials design of metallic thermoelectric compounds by comparing a result of band calculation. On the basis of the Seebeck coefficient measurement, we show the global systematics of thermopower for a wide range of materials (CrSi - MnSi - FeSi - CoSi - Co0.85Ni0.15Si and their interpolating solid solutions). Versatile behaviors of Seebeck coefficient are observed with variations of temperature and electron-number: steep or gradual sign change, a large positive or negative value of Seebeck coefficient, etc. As for the thermoelectricity in these materials, the best performance among these materials is around CoSi at room temperature, showing large adjacent p- and n-type thermopower. The power factor (S2/rho) is evaluated 25 muW/cmK2 at CoSi, which is as high as that of Na0.75CoO2 a material known for a thermoelectric oxide material, though the thermal conductivity is larger (~10 W/mK).
  • Keywords
    Seebeck effect; band structure; chromium compounds; cobalt compounds; iron compounds; manganese compounds; nickel compounds; thermal conductivity; thermoelectric power; Co0.85Ni0.15Si; CoSi; CrSi; FeSi; MnSi; Seebeck coefficient; band calculation; electron number; metallic thermoelectric compounds; solid solutions; temperature 293 K to 298 K; thermal conductivity; thermoelectric power; transition-metal monosilicides; Conducting materials; Filling; Inorganic materials; Reactive power; Solids; Systematics; Temperature dependence; Thermal conductivity; Thermal factors; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2007. ICT 2007. 26th International Conference on
  • Conference_Location
    Jeju Island
  • ISSN
    1094-2734
  • Print_ISBN
    978-1-4244-2262-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2007.4569473
  • Filename
    4569473