DocumentCode
2197531
Title
Filling dependence of thermoelectric power in transition-metal monosilicides
Author
Sakai, A. ; Yotsuhashi, S. ; Adachi, H. ; Ishii, F. ; Onose, Y. ; Tomioka, Y. ; Nagaosa, N. ; Tokura, Y.
Author_Institution
Correlated Electron Res. Center, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba
fYear
2007
fDate
3-7 June 2007
Firstpage
256
Lastpage
259
Abstract
We have investigated temperature and electron-number (band-filling) dependence of Seebeck coefficient in B20-type transition-metal monosilicides experimentally to gain the systematics of thermoelectric properties. This can lead to a perspective on the materials design of metallic thermoelectric compounds by comparing a result of band calculation. On the basis of the Seebeck coefficient measurement, we show the global systematics of thermopower for a wide range of materials (CrSi - MnSi - FeSi - CoSi - Co0.85Ni0.15Si and their interpolating solid solutions). Versatile behaviors of Seebeck coefficient are observed with variations of temperature and electron-number: steep or gradual sign change, a large positive or negative value of Seebeck coefficient, etc. As for the thermoelectricity in these materials, the best performance among these materials is around CoSi at room temperature, showing large adjacent p- and n-type thermopower. The power factor (S2/rho) is evaluated 25 muW/cmK2 at CoSi, which is as high as that of Na0.75CoO2 a material known for a thermoelectric oxide material, though the thermal conductivity is larger (~10 W/mK).
Keywords
Seebeck effect; band structure; chromium compounds; cobalt compounds; iron compounds; manganese compounds; nickel compounds; thermal conductivity; thermoelectric power; Co0.85Ni0.15Si; CoSi; CrSi; FeSi; MnSi; Seebeck coefficient; band calculation; electron number; metallic thermoelectric compounds; solid solutions; temperature 293 K to 298 K; thermal conductivity; thermoelectric power; transition-metal monosilicides; Conducting materials; Filling; Inorganic materials; Reactive power; Solids; Systematics; Temperature dependence; Thermal conductivity; Thermal factors; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location
Jeju Island
ISSN
1094-2734
Print_ISBN
978-1-4244-2262-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2007.4569473
Filename
4569473
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