DocumentCode :
2197572
Title :
Thermoelectric properties of p-type half-Heusler compound: Sn-doped ErNiSb
Author :
Kawano, K. ; Kurosaki, K. ; Sekimoto, T. ; Muta, H. ; Yamanaka, S.
Author_Institution :
Grad. Sch. of Eng., Osaka Univ., Suita
fYear :
2007
fDate :
3-7 June 2007
Firstpage :
267
Lastpage :
269
Abstract :
Polycrystalline half-Heusler compounds of Sn doped ErNiSb ldquoErNiSnxSb1-x (x = 0.00 and 0.05)rdquo were prepared by a spark plasma sintering (SPS) technique. Their thermoelectric properties were evaluated in the temperature range from room temperature to around 1000 K. For ErNiSb, the Seebeck coefficient S indicated positive, and approached 280 muV K-1 around 400 K. The values of the electrical resistivity rho were on the order of 10-5 Omega m. The S and rho indicated semiconductor like characteristic at high temperatures. The maximum value of the power factor S2 rho-1 was 1.4times10-3 W m-1 K-2 around 400~600 K. For 5% Sn-doped ErNiSb: ErNiSn0.05Sb0.95, both the rho and S were lower than those of ErNiSb. Hall effect measurement revealed that Sn-doping led to increase the carrier concentration of ErNiSb. Sn-doping improved the S2 rho-1 of ErNiSb. The S2 rho-1 reached 1.8times10-3 W m-1 K-2 around 650 K.
Keywords :
Hall effect; Seebeck effect; carrier density; doping; electrical resistivity; erbium compounds; nickel compounds; thermoelectric power; ErNiSnxSb1-x; Hall effect; Seebeck coefficient; carrier concentration; doping; electrical resistivity; p-type polycrystalline half-Heusler compound; power factor; spark plasma sintering; temperature 293 K to 298 K; thermoelectric property; Electric resistance; Electrons; Erbium; Plasma properties; Plasma temperature; Power engineering and energy; Sparks; Temperature distribution; Thermoelectricity; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location :
Jeju Island
ISSN :
1094-2734
Print_ISBN :
978-1-4244-2262-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2007.4569476
Filename :
4569476
Link To Document :
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