Title :
Mode-coupling phenomena of packaged coplanar waveguide with mounting grooves
Author :
Yu-De Lin ; Pei-Min Chi
Author_Institution :
Dept. & Inst. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
The influence of packaging metal box on the propagation characteristics of coplanar waveguides is investigated. The coflow mode-coupling phenomena of a coplanar waveguide mode and its packaged box modes are presented. The effect of the mounting groove and other circuit parameters on this mode-coupling phenomenon is also investigated for the design of appropriate packaging boxes.<>
Keywords :
microwave circuits; packaging; spectral-domain analysis; waveguide theory; CPW mode; coflow mode-coupling phenomena; mounting grooves; packaged box modes; packaged coplanar waveguide; packaging metal box; propagation characteristics; Circuits; Coplanar waveguides; Packaging;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335546
