DocumentCode
2197940
Title
Increasing the thermoelectric figure of merit for bismuth and bismuth-antimony
Author
Goldsmid, H.J.
Author_Institution
Univ. of New South Wales, Sydney, NSW
fYear
2007
fDate
3-7 June 2007
Firstpage
357
Lastpage
360
Abstract
Bismuth and bismuth-antimony alloys have proved to be excellent low-temperature thermoelectric materials but their small or negative energy gap has not allowed their use in Peltier or Seebeck devices at ordinary temperatures. Other authors have shown that the energy gap may become large enough for practical purposes if the materials are prepared in low-dimensional form. However, we have demonstrated that the Seebeck coefficient of such materials can be substantially increased by the introduction of ionised-impurity scattering and that this may lead to a dimensionless figure of merit, zT, approaching unity, even if the lattice thermal conductivity is as high as it is in pure bismuth. Our calculations make use of a simple model in which the reciprocals of the relaxation times for lattice and impurity scattering of the charge carriers are supposed to be additive. Furthermore, if the lattice conductivity can be reduced to a value well below that for bulk bismuth, then zT in excess of unity should be obtained. It is possible that this may be achieved for nanostructured samples in which the dimensions are not yet small enough for the band structure to be modified. However, if a positive energy gap can be reached through the formation of a nanostructure this is even better. We conclude that, in some form or other, bismuth and bismuth-antimony must be regarded as most promising materials for nanostructure studies.
Keywords
Seebeck effect; antimony alloys; bismuth; bismuth alloys; energy gap; impurity scattering; nanostructured materials; thermal conductivity; Bi; BiSb; Seebeck coefficient; band structure; charge carriers; energy gap; ionised-impurity scattering; lattice thermal conductivity; nanostucture; thermoelectricity; Bismuth; Conducting materials; Impurities; Lattices; Nanostructured materials; Scattering; Temperature; Thermal conductivity; Thermoelectric devices; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location
Jeju Island
ISSN
1094-2734
Print_ISBN
978-1-4244-2262-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2007.4569494
Filename
4569494
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