DocumentCode :
2197953
Title :
Round-robin studies of two potential seebeck coefficient standard reference materials
Author :
Lowhorn, Nathan D. ; Wong-Ng, W. ; Zhang, W. ; Lu, Z.Q. ; Otani, M. ; Thomas, E. ; Green, M. ; Tran, T.N. ; Dilley, N. ; Ner, Els ; Hogan, T. ; Li, Q. ; Obara, H. ; Sharp, J. ; Venkatasubramanian, R. ; Willigan, R. ; Yang, J. ; Nolas, G. ; Tritt, T.
Author_Institution :
Nat. Inst. of Stand. & Technol., Gaithersburg, MD
fYear :
2007
fDate :
3-7 June 2007
Firstpage :
361
Lastpage :
365
Abstract :
The scientific activities of NIST include the development and distribution of standard reference materials (SRMtrade) for instrument calibration and inter-laboratory data comparison. Full characterization of a thermoelectric material requires measurement of the electrical resistivity, thermal conductivity, and Seebeck coefficient. While standard reference materials exist or have existed for the first two properties, Seebeck coefficient standard reference materials are not available. In an effort to expedite research efforts in this field, we have initiated a project to develop a Seebeck coefficient SRMtrade material. Currently, we have completed a round-robin measurement survey of two candidate materials, Bi2Te3 and constantan (55% Cu and 45% Ni). In this paper, we summarize our plan and development effort, including the results and the methodology used for the round-robin measurement survey.
Keywords :
Seebeck effect; bismuth compounds; copper alloys; measurement standards; nickel alloys; Bi2Te3; CuNi; NIST; Seebeck coefficient SRM; constantan; round-robin measurement survey; standard reference materials; thermoelectric materials; Calibration; Conducting materials; Conductivity measurement; Electric resistance; Electric variables measurement; Instruments; NIST; Standards development; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location :
Jeju Island
ISSN :
1094-2734
Print_ISBN :
978-1-4244-2262-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2007.4569495
Filename :
4569495
Link To Document :
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