Title :
Comparative cost analysis for smart-substrate MCM system
Author :
Werkmann, Hubert ; Höfflinger, Bernd
Author_Institution :
Inst. for Microelectron., Stuttgart, Germany
Abstract :
A cost model for silicon-carrier based MCM systems is presented. The purpose of this cost model is the comparison of test methods for silicon carriers regarding passive substrates and active substrates with integrated test capabilities. Modular models of the different system fabrication steps are developed and combined to a model covering the whole fabrication process. Emphasis is put on the cost modules for substrate fabrication comparing active to passive silicon substrates and on the substrate and system test comparing different test approaches for silicon substrates using test circuitry integrated into an active silicon substrate and the test of passive silicon carriers with conventional test methods
Keywords :
costing; economics; integrated circuit manufacture; integrated circuit testing; microassembling; multichip modules; silicon; substrates; Si; Si substrate; Si-carrier based MCM systems; active substrates; comparative cost analysis; cost model; fabrication process model; integrated test capabilities; passive substrates; smart-substrate MCM system; test methods; Assembly; Circuit testing; Costs; Fabrication; Integrated circuit interconnections; Integrated circuit testing; Microelectronics; Silicon; System testing; Wiring;
Conference_Titel :
Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7789-9
DOI :
10.1109/MCMC.1997.569361
