Design of ICs for flip-chip integration with optoelectronic device arrays

Author

Kiamilev, Fouad E. ; Krishnamoorthy, Ashok V. ; Rozier, Richard G. ; Rieve, James ; Aplin, Gordon F. ; Hull, Christopher D. ; Farbarik, Ray ; Oettel, Richard E.

Author_Institution

North Carolina Univ., Charlotte, NC, USA

fYear

1997

fDate

4-5 Feb 1997

Firstpage

163

Lastpage

167

Abstract

Hybrid integration of optoelectronic devices, such as GaAs MQW modulators, to CMOS VLSI circuits provides the opportunity to design ICs that integrate millions of transistors and thousands of high-speed optical I/Os for high-performance computing and switching applications. One of the challenges in designing such large-scale ICs lies in the development of an efficient method for integrating existing VLSI circuit layouts with two-dimensional arrays of optoelectronic devices. This paper presents several such methods and describes their application

Keywords

CMOS integrated circuits; VLSI; arrays; flip-chip devices; integrated circuit layout; integrated optoelectronics; CMOS VLSI circuit layout; GaAs; GaAs MQW modulator; high-speed optical I/O; hybrid flip-chip integration; large-scale IC design; two-dimensional optoelectronic device array; Circuits; Gallium arsenide; High speed optical techniques; Integrated optics; Optical design; Optical devices; Optical modulation; Optoelectronic devices; Quantum well devices; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-7789-9

Type

conf

DOI

10.1109/MCMC.1997.569363

Filename

569363