• DocumentCode
    2199692
  • Title

    A low-cost solution for automated solder paste application

  • Author

    Dziczkowski, Z.W. ; Geltz, B.R. ; Trimeloni, T.V. ; Berlier, J.A. ; McCollum, J.M.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Virginia Commonwealth Univ., Richmond, VA, USA
  • fYear
    2010
  • fDate
    18-21 March 2010
  • Firstpage
    89
  • Lastpage
    92
  • Abstract
    In electrical and computer engineering, prototyping is a process through which an original concept is represented in a physical system. Creating such a prototype might only necessitate the use of a soldering iron, but specialized equipment can facilitate or in some cases be requisite for complex designs and smaller component packages. This equipment, however, can be prohibitively expensive. This paper proposes a machine which eliminates most of the above issues, a computer numerically-controlled (CNC) solder paste dispenser. To apply solder paste to a design, the machine uses a X/Y gantry to precisely position a syringe of paste and dispense a measured amount.
  • Keywords
    printed circuit design; soldering; soldering equipment; CNC solder paste dispenser; automated solder paste application; computer numerically-controlled solder paste dispenser; low-cost solution; soldering iron; Application software; Computer numerical control; Design engineering; Electrical engineering computing; Iron; Packaging machines; Physics computing; Position measurement; Prototypes; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEEE SoutheastCon 2010 (SoutheastCon), Proceedings of the
  • Conference_Location
    Concord, NC
  • Print_ISBN
    978-1-4244-5854-7
  • Type

    conf

  • DOI
    10.1109/SECON.2010.5453912
  • Filename
    5453912