DocumentCode
2199889
Title
A modular junction topological approach to system interaction problems: simulation and validation
Author
Kirawanich, Phumin ; Thompson, James E. ; Islam, Naz E.
Author_Institution
Department of Electrical and Computer Engineering, University of Missouri, Columbia, Missouri, 65211 USA
fYear
2007
fDate
24-28 Sept. 2007
Firstpage
119
Lastpage
122
Abstract
This paper introduces a new topological scheme for electromagnetic compatibility simulation for aperture-system interactions. By introducing modular scattering junctions as wave propagation paths, this simulation method substitutes the multi-step computational process presented earlier by a single simulation step without ignoring backscattering interactions. The method also allows for modifications in the sub-structural level without simulating the entire system. The simulations involve transmission line matrix compaction, finite-difference timedomain method, and reciprocity theorem to create different junctions. The numerical results generated by this concept have been validated through experimental results and there is a good agreement between the simulated and experimental data.
Keywords
Backscatter; Compaction; Computational modeling; Electromagnetic compatibility; Electromagnetic propagation; Electromagnetic scattering; Finite difference methods; Matrices; Transmission line matrix methods; Transmission line theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2007. EMC Zurich 2007. 18th International Zurich Symposium on
Conference_Location
Munich, Germany
Print_ISBN
978-3-9523286-1-3
Electronic_ISBN
978-3-9523286-0-6
Type
conf
DOI
10.1109/EMCZUR.2007.4388210
Filename
4388210
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