Effect of machining on dielectrical and mechanical properties of ceramics

Author

Bigarre, J. ; Fayeulle, S. ; Jardin, C. ; Le Gressus, C.

Author_Institution

Ecole Centrale de Lyon, Ecully, France

Volume

1

fYear

1996

fDate

21-26 Jul 1996

Firstpage

425

Abstract

Machining effects have been studied on model materials (pure single crystals of Al₂O₃) by different surface preparations: soft polishing (friction) and hard polishing (grinding and diamond polishing). Characterization of point defects created by machining is investigated by cathodoluminescence. Dielectrical ability to form a space charge and the stability of trapped charges is studied by the mirror method recently developed. Mechanical properties are characterized by toughness and friction test. The influence of heat treatments to restore the crystal lattice or to stabilize point defects is also studied in the same experimental methodology. Polishing is associated to the formation of oxygen vacancies which can trap electrons under electronic irradiation. Thermal treatments decrease the charge trapping ability and modify the surrounding of oxygen vacancies. The effect of friction is also discussed in comparison with the polishing results

Keywords

alumina; electric breakdown; heat treatment; insulation testing; machining; materials testing; mechanical properties; polishing; surface treatment; Al₂O₃; cathodoluminescence; ceramics; diamond polishing; dielectric properties; dielectrical ability; electronic irradiation; friction; grinding; hard polishing; heat treatment; insulation breakdown testing; machining effects; mechanical properties; mirror method; oxygen vacancies; point defects characterisation; soft polishing; space charge; surface preparation; toughness; trapped charges stability; Crystalline materials; Crystals; Dielectric devices; Dielectric materials; Electron traps; Friction; Machining; Mechanical factors; Space charge; Stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on

Conference_Location

Berkeley, CA

Print_ISBN

0-7803-2906-6

Type

conf

DOI

10.1109/DEIV.1996.545395

Filename

545395