Title :
Fabrication issues for free-space optics at the board packaging level
Author :
Kostuk, Raymond K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
The successful application of optical interconnects to electronic processing systems requires careful consideration of the: electronic system in which it will be used; optical system and electro-optical device performance; electrical-electro optic interface characteristics; packaging of micro optic components and electro-optic devices with electronic substrates; and the reliability of optical interconnects. In addition, the optical system must be performance and cost competitive with advanced electrical connection methods. We consider several of the above issues at the board packaging level, and the design of relevant optical components for these systems
Keywords :
electro-optical devices; optical elements; optical interconnections; advanced electrical connection methods; board packaging level; cost competitive; electrical-electro optic interface characteristics; electro-optical device performance; electronic processing systems; electronic substrates; fabrication issues; free-space optics; micro optic components; optical components; optical interconnects; optical system; Bandwidth; Bit error rate; Electronics packaging; Electrooptic devices; Optical device fabrication; Optical devices; Optical interconnections; Optical noise; Optical receivers; Power system interconnection;
Conference_Titel :
Massively Parallel Processing Using Optical Interconnections, 1994., Proceedings of the First International Workshop on
Conference_Location :
Cancun
Print_ISBN :
0-8186-5832-0
DOI :
10.1109/MPPOI.1994.336612
