DocumentCode
2201882
Title
An improved characterization method for the dielectric properties of RFIC encapsulating plastics
Author
Jessie, Darryl ; Larson, Lawrence
Author_Institution
Univ. of California, La Jolla, CA, USA
fYear
2002
fDate
2002
Firstpage
197
Lastpage
200
Abstract
A new method has been developed to measure the relative dielectric constant and loss tangent of encapsulating plastic typically used in RFIC package applications. Measured resonances in a rectangular cavity are electromagnetically simulated to obtain the electronic properties of a dielectric material. The advantage of this method is that expensive fixturing is not required, and the electronic properties at any resonance frequency can be obtained.
Keywords
UHF integrated circuits; dielectric loss measurement; permittivity measurement; plastic packaging; RFIC; dielectric material; dielectric properties; electromagnetic simulation; encapsulating plastics; loss tangent; measured resonances; rectangular cavity; relative dielectric constant; Dielectric constant; Dielectric loss measurement; Dielectric materials; Dielectric measurements; Electromagnetic measurements; Electronics packaging; Loss measurement; Plastic packaging; Radiofrequency integrated circuits; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio and Wireless Conference, 2002. RAWCON 2002. IEEE
Print_ISBN
0-7803-7458-4
Type
conf
DOI
10.1109/RAWCON.2002.1030151
Filename
1030151
Link To Document